Advanced Adhesive Technologies
From extreme thermal stability in packaging to high-shear strength in product assembly, explore our comprehensive portfolio of Arkema-Bostik formulations.
Hot Melt Adhesives (HMA)
Featuring Bostik Kizen™ water-white technology. Engineered for end-of-line packaging. Drops application temperatures to 100°C-120°C, eliminates nozzle charring, and guarantees 100% fiber tear.
HM Pressure Sensitive (HMPSA)
Precision bonding for challenging substrates. Our portfolio is formulated for high-expansion carbonated PET lap seams, static non-carbonated labeling, and solvent-resistant wet-wipe cap attachments.
Deep Freeze & Specialized
Synthetic EVA resins (Edgebond™) for high-heat edgebanding, and extreme cold-chain logistics formulations (Kizen™ Freeze) that maintain structural integrity down to -28°C.
Interactive Adhesive Selector
Find the exact Bostik formulation engineered for your specific production line.
1Select Production Application
2Recommended Formulation
Select Production Application
The engine will instantly recommend the optimal Bostik formulation based on your exact operational requirements.